Search results

Results 1 – 19 of 19
Advanced search

Search in namespaces:

There is a page named "Leadframe" on Wikipedia

  • Thumbnail for Lead frame
    Lead frame (redirect from Leadframe)
    two sections: a die paddle, where the die sits in the leadframe, and the leads. The leadframe is made of an alloy the molding compound can adhere to...
    4 KB (436 words) - 03:42, 1 March 2024
  • Thumbnail for Flat no-leads package
    circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology...
    15 KB (1,874 words) - 14:32, 5 August 2024
  • Thumbnail for Quad flat package
    variants, CERQUAD and CQFP: Hereby the leadframe is attached between two ceramic layers of the package. The leadframe is attached using glass. This package...
    9 KB (1,158 words) - 17:07, 8 June 2024
  • Thumbnail for Surface-mount technology
    Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface...
    34 KB (4,441 words) - 17:10, 30 August 2024
  • Thumbnail for Small-outline transistor
    December 19, 2018. Retrieved 2022-05-25. link from amkor.com/packaging/leadframe/sot23-tsot "Nexperia SOT 23 Package and Dimensions". SOT23 and SOT 23-3...
    14 KB (679 words) - 12:33, 21 January 2024
  • Meridian Lossless Packing, a lossless compression codec for audio data Micro Leadframe Package, a surface mount integrated circuit package Mobile Location Protocol...
    3 KB (351 words) - 21:26, 20 August 2024
  • Thumbnail for Ball bonding
    called the leadframe). The machine again descends to the surface, this time without making a ball so that the wire is crushed between the leadframe and the...
    8 KB (1,076 words) - 00:29, 23 April 2024
  • Thumbnail for Chip-scale package
    scale packages can be classified into the following groups: Customized leadframe-based CSP (LFCSP) Flexible substrate-based CSP Flip-chip CSP (FCCSP) Rigid...
    3 KB (370 words) - 22:06, 25 August 2023
  • Thumbnail for List of integrated circuit packaging types
    aviation electronics because of robustness to mechanical vibration. Micro leadframe package (MLP, MLF): with a 0.5 mm contact pitch, no leads (same as QFN)...
    61 KB (3,391 words) - 00:31, 3 August 2024
  • Thumbnail for ASE Group
    is a method of flipping the chip to connect with either substrate or leadframe. According to the research firm Yole Développement, the flip chip technology...
    12 KB (1,326 words) - 11:01, 2 August 2024
  • of a pair of crossed over tracts, on each side of the brainstem Micro-leadframe, a type of connection between integrated circuits and printed circuit...
    1 KB (182 words) - 17:45, 24 December 2023
  • Thumbnail for Wire bonding
    expansion (CTE) mismatch between the epoxy molding compound (EMC), the leadframe, the die, the die adhesive, and the wire bond. This leads to low cycle...
    21 KB (2,442 words) - 01:50, 15 August 2024
  • Thumbnail for Semiconductor device fabrication
    or wafer dicing IC packaging Die attachment (The die is attached to a leadframe using conductive paste or die attach film.) IC bonding: Wire bonding,...
    106 KB (11,201 words) - 22:23, 24 August 2024
  • Thumbnail for Toppan
    Semiconductors: photomasks for semiconductors, design services for LSI, device OEM, leadframes, BGA/CSP substrates, color filter arrays for image sensors and small display...
    7 KB (355 words) - 13:39, 31 July 2024
  • bonder aimed at LED manufacturers. By the end of the 1980s, the sales of leadframes and equipment provided steady profit streams for ASMPT. At the end of...
    10 KB (870 words) - 13:43, 2 August 2024
  • Thumbnail for Restriction of Hazardous Substances Directive
    lead-free components' compatibility with lead-containing solder processes. Leadframe-based components, such as Quad Flat Packages (QFP), Small Outline Integrated...
    68 KB (7,751 words) - 23:38, 2 May 2024
  • circuitry inside a package with components outside the package lead frame (or leadframe) – a metal structure inside a package that connects the chip to its leads...
    14 KB (1,689 words) - 11:55, 18 October 2023
  • Thumbnail for Photochemical machining
    heating elements, RF and microwave circuits and components, semiconductor leadframes, motor and transformer laminations, metal gaskets and seals, shields and...
    6 KB (780 words) - 06:36, 6 November 2022
  • coils, sliding electrical contacts, arc welder electrodes, electronic leadframes, MIG contact tips, commutators, high speed motor and generator components...
    13 KB (886 words) - 10:39, 1 July 2024