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There is a page named "HVQFN" on Wikipedia

  • Thumbnail for Flat no-leads package
    Flat no-leads package (redirect from HVQFN)
    Micro-Systems, 2007 IEEE, 2007. De Vries, J., et al. "Solder-joint reliability of HVQFN-packages subjected to thermal cycling." Microelectronics Reliability 49...
    15 KB (1,874 words) - 00:12, 28 March 2024
  • Thumbnail for Quad flat package
    Heat sink quad flat package, heatsink very thin quad flat-pack no-leads (HVQFN) is a package with no component leads extending from the IC. Pads are spaced...
    9 KB (1,158 words) - 17:07, 8 June 2024
  • Thumbnail for Secure access module
    SAM in a HVQFN housing...
    4 KB (438 words) - 18:11, 23 June 2024
  • Thumbnail for NXP Semiconductors
    NXP LPC1114 in 33-pin HVQFN package and LPC1343 in 48-pin LQFP package, both ARM Cortex-M microcontrollers...
    32 KB (2,991 words) - 19:10, 7 July 2024
  • Thumbnail for List of integrated circuit packaging types
    flat package MQFP Metric quad flat-pack QFP with metric pin distribution HVQFN Heat-sink very-thin quad flat-pack, no-leads SIDEBRAZE [clarification needed]...
    62 KB (3,395 words) - 11:34, 4 July 2024
  • Thumbnail for NXP LPC
    NXP LPC1114 in 33-pin HVQFN package and LPC1343 in 48-pin LQFP package....
    47 KB (3,985 words) - 01:00, 26 June 2024