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There is a page named "Ceramic pin grid array" on Wikipedia

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  • Thumbnail for Pin grid array
    A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular...
    10 KB (967 words) - 19:02, 23 February 2024
  • Thumbnail for Ball grid array
    BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation...
    17 KB (2,026 words) - 23:38, 25 July 2024
  • Thumbnail for Land grid array
    The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a...
    9 KB (1,272 words) - 10:30, 16 June 2024
  • Thumbnail for List of integrated circuit packaging types
    or columns arranged in a grid pattern. The body of the component is ceramic. Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch)...
    62 KB (3,395 words) - 11:34, 4 July 2024
  • Thumbnail for Integrated circuit packaging
    first area array package was a ceramic pin grid array package. Not long after, the plastic ball grid array (BGA), another type of area array package, became...
    15 KB (1,597 words) - 20:25, 22 April 2024
  • Thumbnail for Socket A
    Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird...
    8 KB (736 words) - 11:32, 29 June 2024
  • Thumbnail for Socket AM2
    incompatible with 939 motherboards and vice versa, and although it has 940 pins, it is incompatible with Socket 940. Socket AM2 supports DDR2 SDRAM memory...
    6 KB (589 words) - 18:41, 6 June 2024
  • Thumbnail for RISC Single Chip
    of wiring. It is packaged in a 36 mm by 36 mm ceramic pin grid array module which had 201 signal pins. It required a 3.6 volt power supply and consumed...
    4 KB (655 words) - 23:51, 19 February 2023
  • Thumbnail for Quad flat package
    process and alignment of parts during assembly. The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over...
    9 KB (1,158 words) - 17:07, 8 June 2024
  • Thumbnail for PA-7100
    metal–oxide–semiconductor (CMOS) process. The PA-7100 is packaged in a 504-pin ceramic pin grid array that has a copper-tungsten heat spreader. An improved PA-7100...
    5 KB (488 words) - 12:38, 23 November 2022
  • Thumbnail for Dual in-line package
    respectively) Pin grid array (PGA) packages may be considered to have evolved from the DIP. PGAs with the same 0.1 inches (2.54 mm) pin centers as most...
    23 KB (3,267 words) - 10:11, 26 July 2024
  • CPGA may stand for: Ceramic pin grid array, a kind of a package for integrated circuits Cornish Pilot Gig Association This disambiguation page lists articles...
    150 bytes (51 words) - 03:59, 28 December 2019
  • Thumbnail for R4000
    in a 179-pin ceramic pin grid array (CPGA). The R4000SC and R4000MC are packaged in a 447-pin ceramic staggered pin grid array (SPGA). The pin out of the...
    13 KB (1,806 words) - 15:26, 31 May 2024
  • Thumbnail for Socket AM2+
    memory controller The pin configuration of the AM2+ socket (940 pins) is mechanically different from the AM3 socket (941 pins) The 4 holes for fastening...
    6 KB (632 words) - 16:35, 20 July 2024
  • interconnect. It was packaged in a 179-pin ceramic pin grid array that was compatible with the R4x00PC and R4600, or a 208-pin plastic quad flat pack (PQFP)....
    7 KB (924 words) - 21:05, 16 August 2023
  • Thumbnail for Intel i960
    (JIAWG) 32-bit ISA standard. It was originally packaged in a 348 lead ceramic pin grid array and later supplied as a bare die. The i960 MX supports object-oriented...
    23 KB (2,480 words) - 17:05, 15 June 2024
  • Thumbnail for VAX 6000
    transistors on a 0.595 by 0.586 inch die packaged in a custom 339-pin ceramic pin grid array (CPGA). The system supported a maximum of 1 GB of memory. Computergram...
    6 KB (952 words) - 05:48, 31 May 2024
  • Thumbnail for R10000
    was packaged in a 527-pin ceramic pin grid array (CPGA); and that vendors also investigated the possibility of using a 339-pin multi-chip module (MCM)...
    20 KB (2,607 words) - 01:37, 19 May 2024
  • Thumbnail for R5000
    was packaged in a 272-ball plastic ball grid array (BGA) or 223-pin ceramic pin grid array (PGA). It was not pin-compatible with any previous MIPS microprocessor...
    12 KB (1,810 words) - 23:11, 28 February 2024
  • Thumbnail for Vacuum tube
    with the suppressor grid wired internally to the cathode (e.g. EL84/6BQ5) and those with the suppressor grid wired to a separate pin for user access (e...
    119 KB (15,348 words) - 04:21, 17 July 2024
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